Our Subjects
![[Translate to Englisch:]](/fileadmin/user_upload/Presse_und_Medien/Bilder_Allgemein/_processed_/3/8/csm_fotolia-43295677-s-thomaslerchphoto-fotolia-2019-05-23-114642_1ad653f91c.jpg "[Translate to Englisch:]")
New US administration:
ZVEI calls for new impetus in trade relations
Results: 28
03.06.2024
Technical Guideline – TLF 0214 Validation of Low Voltage Automotive Connectors
This technical guideline represents a non-binding technical description of test procedures for automotive connectors up to 60 V DC. Representatives of the connector manufacturers in the ZVEI…
25.01.2024
Report General Assembly, Electronic Components and Systems Division and PCB and Electronic Systems Division
The report on the 2023 General Meeting of the two associations Electronic Components and Systems (ECS) and Printed Circuit Boards and Electronic Systems (PCB-ES) informs the reader about current…
09.06.2022
Towards an ambitious, value-adding and realistic EU Chips Act
In the next decades, Europe's downstream industries will need both high-performance processors in smaller structure sizes and power semiconductors, sensors or microelectromechanical systems (MEMS)…
25.04.2022
EU Chips Act must make Europe more attractive for investment
In order to avoid supply bottlenecks in the future, it is necessary to significantly build up and expand the semiconductor industry and reduce one-sided dependencies in international competition.…
February
04.11.2021 | Europe
Semiconductor Strategy for Germany and Europe - Discussion Paper
ZVEI e.V. has published the paper "Semiconductor Strategy for Germany and Europe", which outlines the first steps towards a comprehensive, long-term, sustainable and effective strategy to strengthen…
01.12.2020
Software for Safety-Related Automotive Systems (Best Practice Guideline)
This guideline provides lessons-learned, experiences and best practices related to the application of ISO 26262 for the development of software. Version 2
November